Controlled Thermal Debonding of Epoxy Adhesives Using Non-Intumescent Organophosphorus-Based Flame-Retardants [* Cross-Reference *]

We investigate the performance of a structural adhesive system modified with the debonding agent at various concentrations (0, 10, 20, 30, and 40 wt%). The mechanical properties and thermal/mechanical degradation of these joints were assessed using a modified pull-off test with specific experimental parameters, including surface preparation, adhesive gap, substrate thickness, and curing temperatures.

Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) were conducted to evaluate the physicochemical properties of the resin samples. Scanning electron microscopy (SEM) was used to analyze the dispersion of the debonding agent in the epoxy matrix and examine the joint microstructure. This study employs tomography to examine the modified resin both before and after reaching the debonding temperature.