A unified framework for thermoelectric cooling optimization across thermal boundary conditions

The package contains the fixed-device 22-case analytical benchmark, 45,761 current-response samples across 28 allowed intervals, 44 solved matched-current COMSOL models and result files, mesh and energy-balance checks, FEM current-refinement and competing-branch records, figure source data, saved temperature-bound and thermal-conductance sensitivity sweeps, and the retained p-type property table with S30 verification code.

Data, documentation and author-owned model configurations use CC BY 4.0; original code uses the MIT licence stated in LICENSE-CODE.txt. COMSOL and external dependencies are excluded. The README, data dictionaries, Figure data map.csv and Source map.csv describe file contents, units, provenance, current figure numbering and scientific scope.