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Data · dataset · 2026

Semimetal Bi/MoS2 Memristor Exhibiting Ultrahigh Switching Ratio and Mechanistic Insights Into Transport via Low-Temperature Characterization

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We report Bi/MoS2/poly-Si memristors fabricated through a CMOS-compatible, transfer-free, and wafer-scale process.

Description

The semimetal Bi top electrode (TE) provides a low Schottky barrier and reduced contact resistance, enabling an ultrahigh on/off ratio exceeding 106 , endurance up to 10^3 cycles, and retention longer than 10^4 s. The devices show highly uniform bipolar switching with forming-free operation and tight cycle-to-cycle and device-to-device distributions.

Time-dependent dielectric breakdown (TDDB) suggests improved resistance to constant-stress degradation in Bi-based devices compared with Al-capped counterparts, which is attributed to suppressed sulfur-vacancy-assisted leakage. Temperature-dependent I – V characteristics down to 20 K reveal distinct conduction regimes: direct tunneling and Poole–Frenkel emission in the high-resistance state (HRS), and a Schottky-to-Ohmic transition in the low-resistance state (LRS).

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The reduced trap density and contact barrier at the Bi/MoS2 interface account for the high switching ratio and stable low-temperature operation. These findings establish a quantitative correlation between electrode/interface engineering and charge-transport mechanisms, providing mechanistic insights into semimetal–2-D interfaces for low-power and reliable memory applications.

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