Improvement of graphene oxide/epoxy resin adhesive properties through interface modification

The heat-conducting, dielectric, and bonding properties of a composite adhesive have been enhanced using toluene diisocyanate (TDI) to chemically modify the interface between graphene oxide (GO) and epoxy resin (EP), which was characterized using Fourier-transform infrared spectroscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. The thermal conductivity of TDI 10 -GO 0.5 /EP was 0.624 W·m −1 ·K −1 (166% of EP and 117% of GO 0.5 /EP), with its TDI 10 -GO 0.5 /EP interfacial thermal resistance being reduced by a factor of 36 times GO 0.5 /EP.

The insulating properties of the adhesive in small resistors and capacitors were improved by the inclusion of GO, with the dielectric strength of the adhesive shown to be 25.96 kV·mm −1 and its volume resistivity found to be 1.50 × 10 14 Ω·m.