Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by onestep HIP techni

In the HIP process, both W-Cu/CuCrZr and CuCrZr/316L joints were connected simultaneously by diffusion bonding at 900 °C, 130 MPa for 2 h. Then for recovering the strength of CuCrZr alloy, heattreatment process of solution annealing at 900 °C for 1 h which followed by water quench and aging treatment at 480 °C for 2 h were imposed on the HIPed module.

After the heat treatment process, assessments on the microstructure, tensile test and Charpy impact test of the bonding joints were performed. Microstructural analysis showed that both the bonding joints were well welded and transition zones were observed along the interfaces of the joints. The microstructure of CuCrZr alloy was homogeneous with equiaxed grains and its mean grain size was around 42 μm.