Measurement of thermal conductivity of epoxy resins during cure

Includes also the sensitivity analysis of the measurement on thermocouple misplacement. - -RTM6_cure_kinetics_results: Includes the isothermal and dynamic data for the RTM6 cure kinetics characterisation and the corresponding model. It also includes the sensitivity analysis on period and amplitude influence for RTM6 - - 890RTM_cure_kinetics_results: Includes the isothermal and dynamic data for the 890RTM cure kinetics characterisation and the corresponding model.

It also includes the sensitivity analysis on period and amplitude influence for 890RTM - - XU3508_cure_kinetics_results: Includes the isothermal and dynamic data for the XU3508 cure kinetics characterisation and the corresponding model. - -Di Benedetto_XU3508: Includes the dataused to build the Di Benedetto equation for the XU3508 resin system and the corresponding model - - Cp_density_conductivity_data: Includes the Cp data and model, the density and the thermal conductivity data for the three resin systems under investigation: RTM6, 890RTM and XU3508 - -Thermal_conductivity_model: Includes the data from the thermal conductivity tests for the three resin system and the fitting of the experimental data with the analytical model.